CXA2016S Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXA2016S

Sync Identification for CRT Display

Sony Semiconductor 

Package Outline Unit : mm

22PIN SDIP (PLASTIC)

+ 0.4

19.2 – 0.1

22

12

1

11

1.778

CXA2016S

0° to 15°

0.5 ± 0.1

+ 0.15

0.9 – 0.1

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-22P-01

SDIP022-P-0300

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.95g

—12—

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