UPD16814GS Просмотр технического описания (PDF) - NEC => Renesas Technology

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UPD16814GS

MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT

NEC => Renesas Technology 

µPD16814

RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the conditions shown below.

For soldering methods and conditions other than those listed below, consult NEC.

For details of the recommended soldering conditions, refer to Information Document “Semiconductor Device

Mounting Technology Manual” (C10535E).

Surface Mount Type

Soldering Method

Soldering Condition

Symbol of Recommended

Soldering

Infrared reflow

Package peak temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.)

Number of times: 2 MAX.

<Precautions>

(1) Start the second reflow after the device temperature rise due to the first

reflow has dropped to room temperature.

(2) Do not clean flux with water after the first reflow.

IR35-00-2

VPS

Package peak temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.)

Number of times: 2 MAX.

<Precautions>

(1) Start the second reflow after the device temperature rise due to the first

reflow has dropped to room temperature.

(2) Do not clean flux with water after the first reflow.

VP15-00-2

Wave soldering

Soldering bath temperature: 260 °C MAX., Time: 10 seconds MAX.,

Number of times: 1

Preheating temperature: 120 °C MAX. (package surface temperature)

WS60-00-1

Partial heating Pin temperature: 300 °C MAX., Time: 3 seconds MAX. (per side of device)

–

Caution Do not use two or more soldering methods in combination (except partial heating).

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