HT1350 Просмотр технического описания (PDF) - Holtek Semiconductor
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HT1350 Datasheet PDF : 6 Pages
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Pad Assignment
HT1350
TEST2
TEST1
O SC2
1 32
2
3
O SC1
4
O U T17
5
O U T16
6
O U T15
7
O U T14
8
31 30
29 28 27 26
25 S TE P
24 C P 1
(0 ,0 )
23 C P 2
22 C P 3
21 C O M 1
20 C O M 2
9 10 11 12 13 14 15 16 17 18 19
Chip size: 2725 ´ 2780 (mm)2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Unit: mm
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
X
-1206.00
-1206.00
-1206.00
-1206.00
-1206.00
-1206.00
-1206.00
-1206.00
-1098.00
-898.00
-633.00
-433.00
-168.00
32.00
297.00
497.00
Y
1159.50
994.50
661.70
71.50
-159.50
-359.50
-624.50
-824.50
-1190.50
-1190.50
-1190.50
-1190.50
-1190.50
-1190.50
-1190.50
-1190.50
Pad No.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
X
762.00
962.00
1202.00
1202.00
1202.00
1202.00
1202.00
1202.00
1202.00
1078.00
812.00
631.00
447.00
-59.00
-259.00
-966.00
Y
-1190.50
-1190.50
-1190.50
-753.50
-335.50
-135.50
65.50
259.50
537.00
1167.50
1167.50
1167.50
1167.50
1167.50
1167.50
1167.50
2
June 28, 1999
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