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MG73PB08 Просмотр технического описания (PDF) - Oki Electric Industry

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MG73PB08 Datasheet PDF : 22 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
s MG113P/114P/115P/73P/74P/75P s ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
BGA Package Menu
Base Array
MG11xP14
MG11xP18
MG11xP22
MG11xP28
Body Size (mm)
Lead Pitch (mm)
Ball Count
Signal I/O
Power Ball
GND Ball
Product Name
MG7xPB02
MG7xPB04
MG7xPB06
MG7xPB08
MG7xPB10
MG7xPB12
MG7xPB14
MG7xPB16
MG7xPB18
MG7xPB20
MG7xPB22
MG7xPB24
MG7xPB26
MG7xPB28
MG7xPB30
MG7xPB32
MG7xPB34
MG7xPB36
MG7xPB38
MG7xPB40
MG7xPB42
I/O Pads [1]
68
108
148
188
228
268
308
348
388
428
468
508
548
588
628
668
708
748
788
828
868
1. I/O Pads can be used for input, output, bi-directional, power, or ground.
q = Available now
256
q
q
q
q
q
q
q
q
q
27x27
1.27
256
231
12
13
BGA
352
420
q
q
q
q
q
q
q
q
q
q
35x35
1.27
352
304
16
32
q
q
q
q
q
q
q
q
q
35x35
1.27
420
352
32
36
560
q
q
q
q
q
35x35
1.00
560
400
80
80
18
Oki Semiconductor

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