MG75PB08 Просмотр технического описания (PDF) - Oki Electric Industry
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MG75PB08 Datasheet PDF : 22 Pages
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––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– s MG113P/114P/115P/73P/74P/75P s
Oki’s boundary scan methodology meets the JTAG Boundary Scan standard, IEEE 1149.1-1990. Oki sup-
ports boundary scan on both Sea of Gates (SOG) and Customer Structured Array (CSA) ASIC technolo-
gies. Either the customer or Oki can perform boundary-scan insertion. More information is available in
Oki’s JTAG Boundary Scan Application Note. (Contact the Oki Application Engineering Department for
interface options.)
PACKAGE OPTIONS
TQFP, LQFP and QFP Package Menu
Base Array
MG11xP14
MG11xP18
MG11xP22
MG11xP28
Body Size (mm)
Lead Pitch (mm)
Product Name
MG7xPB02
MG7xPB04
MG7xPB06
MG7xPB08
MG7xPB10
MG7xPB12
MG7xPB14
MG7xPB16
MG7xPB18
MG7xPB20
MG7xPB22
MG7xPB24
MG7xPB26
MG7xPB28
MG7xPB30
MG7xPB32
MG7xPB34
MG7xPB36
MG7xPB38
MG7xPB40
MG7xPB42
I/O Pads [1]
68
108
148
188
228
268
308
348
388
428
468
508
548
588
628
668
708
748
788
828
868
LQFP
144
176
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
20 x 20
0.5
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
24 x 24
0.5
1. I/O Pads can be used for input, output, bi-directional, power, or ground.
q = Available now
208
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
28 x 28
0.5
QFP
208
240
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
28 x 28
0.5
q
q
q
q
q
32 x 32
0.5
TQFP
100
q
q
q
q
q
q
q
q
q
q
q
q
q
14 x 14
0.5
Oki Semiconductor
17
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