TDA8000 Просмотр технического описания (PDF) - Philips Electronics

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Компоненты Описание

производитель

TDA8000

Smart card interface

Philips Electronics 

Philips Semiconductors

Smart card interface

Product specification

TDA8000; TDA8000T

SYMBOL

PARAMETER

CONDITIONS

MIN.

Data lines [I/O1, I/O2, I/O1(µC), I/O2(µC)]; note 5

VOH

HIGH level output voltage on I/O 4.5 < VSUP < 5.5;

4

4.5 < VI/O(µC) < 5.5;

IOH = −20 µA

4.5 < VSUP < 5.5;

2.4

4.5 < VI/O(µC) < 5.5;

IOH = −200 µA

VOL

LOW level output voltage on I/O II/O = 1 mA;

−

I/O(µC) grounded

IIL

LOW level input current on I/O(µC) I/O(µC) grounded;

−

II/O = 0

I/O(µC) grounded;

−

I/O connected to VCC

VOH

HIGH level output voltage on

4.5 < VI/O < 5.5

4

I/O(µC)

VOL

LOW level output voltage on

II/O(µC) = 1 mA;

−

I/O(µC)

I/O grounded

IIL

VIDLE

ZIDLE

LOW level input current on I/O

voltage on I/O outside a session

impedance on I/O(µC) outside a

session

I/O grounded; II/O(µC) = 0 −

I/O grounded; I/O(µC) −

connected to VSUP

−

10

Rpu

internal pull-up resistance between

17

I/O and VCC

tr, tf

rise and fall times

Ci = Co = 30 pF

−

Protections

Tsd

ICC(sd)

IPP(sd)

II/O(sd)

shut-down local temperature

shut-down current at VCC

shut-down current at VPP

shut-down current at I/O

from I/O to I/O(µC)

−

−175

−90

3

Timing

tact

activation sequence duration

see Fig.6

250

tde

deactivation sequence duration see Fig.8

250

t3

start of the window for sending

see Fig.6

−

CLK to the card

TYP.

MAX. UNIT

−

VCC + 0.2 V

−

−

V

−

65

mV

−

−500

µA

−

−5

mA

−

VSUP + 0.2 V

−

70

mV

−

−500

µA

−

−5

mA

−

0.4

V

−

−

MΩ

20

23

kΩ

−

1

µs

135

−

°C

−

−230

mA

−

−140

mA

−

5

mA

−

500

µs

−

500

µs

−

140

µs

1996 Dec 12

15

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