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Компоненты Описание
HCTS27MS Просмотр технического описания (PDF) - Intersil
Номер в каталоге
Компоненты Описание
производитель
HCTS27MS
Radiation Hardened Triple 3-Input NOR Gate
Intersil
HCTS27MS Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
B1 (2)
HCTS27MS
HCTS27MS
A1
VCC
C1
(1)
(14)
(13)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
Y2
GND
Y3
(12) Y1
(11) C3
(10) B3
(9) A3
Spec Number
518643
437
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