PT6601 is a Segment Driver LCD Driver IC utilizing CMOS Technology used for Large Scale Dot Matrix Liquid Crystal Graphic Displays. 80 bits of display data sent from a controller are latched using a 4-bit parallel transfer technique and LCD drive signals are generated. It can be used with Common LCD Driver, PT6630 to drive Large Screen LCD Panels.
• CMOS Technology
• Supports Display Duties from 1/64 to 1/256
• Operating Supply Voltage:
VDD (Logic Block): 5V + 10%
VDD -VEE (LCD Block): 12 to 32 V
• Operating Temperature: -20 to +75°C
• Supports Power Reduction in Large Scale Panel via a Chip Disable Pin
• LCD Drive Circuit for 80 bits Display
• 4 -Bit Parallel Data Input
• Maximum of 6.0 MHz Data Transfer Clock and Bidirectional Shifting Supported
GENERAL DESCRIPTION The ST6 Real Time Development System is an advanced hardware development system designed and configured to provide comprehensive support for the ST6 family of MCUs.
Hardware Features ■ Real time emulation ■ 32 Kbytes of emulation memory ■ Breakpoint on a single address or on an address range ■ Break events can be defined in Program Space or Data space combined with up to 4 external signals ■ 2 fully programmable signal outputs for hardware triggering or timing measurements ■ Register read/write on-the-fly (without wait states) ■ Selective trace in Address Range or Start/Stop mode ■ Break on stack overflow ■ 1 Kbytes of real trace memory ■ Tracing of up to 32 bits including 4 external signals
Software Features Raisonance IDE and C Compiler (optionally available) ■ IDE Interface (Ride) for Windows 95, Windows 98 and Windows NT ■ C or assembler source-level debugging
DESCRIPTION STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance. STATS ChipPAC’s chip stacking technology allows the integration of multiple ICs within a single Package to improve Package performance and functionality while reducing overall Package size and cost.
FEATURES • Combining devices into one Package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips into a single Package • Die to die bonding capability for device/signal integration • Standard and green/lead-free materials and Pb-free plating • Options for mixed technologies, 2 or more stacked dice • Fine pitch bonding capability • Exposed pad provides enhanced thermal performance • Low profile Package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD) • Lead pitch ranges from 0.80mm to 0.40mm • Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD) • JEDEC standard compliant Package outlines
DESCRIPTION The ST62 gang programmers are designed for programming up to 10 EPROM or OTP devices. It can run either in standalone or remote mode under control of a Windows compatible PC. In standalone mode, the target ST62 MCUs are programmed with a simple key operation directly from a master EPROM memory or from a master EPROM MCU. Two color LEDs indicate for each target device the operational pass or fail. Both VERIFY and BLANK CHECK functions are pro vided. In Remote mode, the gang programmer is connected to a PC through an RS232 serial channel. Object code in either S19 or INTEL HEX format is read from disk files to program the target devices. The Windows software also offers VERIFY, BLANK CHECK, READ master and other utility functions. The software allows various user friend ly facilities, such as re-instating the same pro gramming session, user selectable programming steps. The gang programmer is made up of a two parts, a base unit common to all ST62XX devices and a dedicated Package adaptator.
HARDWARE FEATURES ■ Programs simultaneously up to 10 ST62Exx EPROM and OTP MCUs ■ Standalone and PC driven modes ■ DIP and SO Packages supported
SOFTWARE FEATURES ■ Windows based software ■ S19 or INTEL hex file format
Function The M201T-56FP is a converter for the M30201 Group for connecting the emulation pod probe M30201T-PRB to a foot pattern of a 56-pin 0.65mm-pitch QFP (56P6S-A).
Application Mount TQPACK056SB on the foot pattern on the target system. On top of it, mount TQSOCKET056SBP, TQSOCKET056SBF and M30201T-56FP in that order. Then connect the probe M30201T-PRB of the emulation pod to the connector provided at the top of the M30201T-56FP.
Package Components • M30201T-56FP • TQSOCKET056SBP (made by Tokyo Eletech Co., Ltd.) • TQPACK056SB (made by Tokyo Eletech Co., Ltd.) • Users manual *Required components to connect to the target system are included with this product Package. Each component made by Tokyo Eletech Co., Ltd. is optionally available alone from Tokyo Eletech Co., Ltd. See Appendix G "Contact Addresses for Partner Products".
The NT3881D is a dot matrix LCD controller and driver LSI that can operate with either a 4-bit or an 8-bit microprocessor (MPU). NT3881D receives control character codes from the MPU, stores them in an internal RAM (up to 80 characters), transforms each character code into a 5 X 7, 5 X 8, or 5 X 10 dot matrix character pattern, and then displays the codes on the LCD panel. The built-in Character Generator ROM consists of 256 different character patterns.