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Номер в каталоге(s) : IRF830S
IR
International Rectifier
Компоненты Описание : description

description
Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

• Surface Mount
available.in Tape & Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements

Номер в каталоге(s) : 2SA1694 A1694
Iscsemi
Inchange Semiconductor
Компоненты Описание : description

description

·High Collector-Emitter Breakdown Voltage V(BR)CEO= -120V(Min)

·Good Linearity of hFE

·Complement to Type 2SC4467



APPLICATIONS

·Designed for audio and general purpose applications


Номер в каталоге(s) : INN180 TDA955
ETC
Unspecified
Компоненты Описание : EXAMINATION in Hradware description and Verification

EXAMINATION in Hradware description and Verification

Номер в каталоге(s) : AON7538 AON7538L
ETC
Unspecified
Компоненты Описание : DFN3X3 PACKAGE MARKING description

[Alpha & Omega Semiconductor, Ltd.]

DFN3X3 PACKAGE MARKING description

Номер в каталоге(s) : AO3410 AO3410L
AOSMD
Alpha and Omega Semiconductor
Компоненты Описание : PACKAGE MARKING description

PACKAGE MARKING description

Номер в каталоге(s) : AON7414 AON7414L
ETC
Unspecified
Компоненты Описание : DFN 3X3 PACKAGE MARKING description

[Alpha & Omega Semiconductor, Ltd.]

DFN 3X3 PACKAGE MARKING description

Номер в каталоге(s) : M14C16DD M14C16_DD
ST-Microelectronics
STMicroelectronics
Компоненты Описание : M14C16 Die description

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm).

PRODUCT M14C16
■ WAFER SIZE 152 mm (6 inches)
■ DIE IDENTIFICATION M14C16KA_R
■ DIE SIZE (X x Y) 1390 x 2375 µm
■ SCRIBE LINE 101.8 x 102.4 µm
■ PAD OPENING 100 x 100 µm

DIE LAYOUT
■ DI Die Identification (at the position shown in Figure 1)
■ C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
■ C4, C6, C8 These ISO pins do not appear on the M14C16 die
■ NC This pad, shown in Figure 1, is Not Connected

Номер в каталоге(s) : M14C32DD M14C32_DD
ST-Microelectronics
STMicroelectronics
Компоненты Описание : M14C32 Die description

PRODUCT                        M14C32
■ WAFER SIZE                152 mm (6 inches)
■ DIE IDENTIFICATION   M14C32KA_R
■ DIE SIZE (X x Y)            2040 x 2355 µm
■ SCRIBE LINE                100.5 x 101.7 µm
■ PAD OPENING              100 x 100 µm

Номер в каталоге(s) : AO4578L AO4578
AOSMD
Alpha and Omega Semiconductor
Компоненты Описание : SO8 PACKAGE MARKING description

SO8 PACKAGE MARKING description

Номер в каталоге(s) : AOD474B AOD474BL
AOSMD
Alpha and Omega Semiconductor
Компоненты Описание : DPAK (TO-251) PACKAGE MARKING description

DPAK (TO-251) PACKAGE MARKING description

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