Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits
English
한국어
日本語
русский
简体中文
español
Номер в каталоге
Компоненты Описание
HCS08MS Просмотр технического описания (PDF) - Intersil
Номер в каталоге
Компоненты Описание
производитель
HCS08MS
Radiation Hardened Quad 2-Input AND Gate
Intersil
HCS08MS Datasheet PDF : 8 Pages
1
2
3
4
5
6
7
8
Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
B1 (2)
HCS08MS
HCS08MS
A1
VCC
B4
(1)
(14)
(13)
Y1 (3)
A2 (4)
B2 (5)
(6)
(7)
(8)
Y2
GND
Y3
(12) A4
(11) Y4
(10) B3
(9) A3
Spec Number
518746
8
Share Link:
datasheetq.com [
Privacy Policy
]
[
Request Datasheet
] [
Contact Us
]