Plastic-Encapsulate Bridge Rectifier
FEATURES
•Rating to 1000V PRV
•Ideal for printed circuit board
•Reliable low cost construction utilizing
molded plastic technique results in inexpensive product
•Lead tin plated copper
Mechanical Data
• Polarity:Symbol molded on body
• Mounting position :Any
MB05M --- MB10M
~~
+-
.217(5.5)
.177(4.5)
.031(0.8)
.019(0.5)
.106(2.7)
.090(2.3)
MBM
.193(4.9)
.177(4.5)
C0.5
.106(2.7)
.090(2.3)
.051(1.3)
.035(0.9)
.165(4.2)
.146(3.7)
.031(0.8)
.019(0.5)
.014(.35)
.006(.15)
.106(2.7)
090(2 3)
.256(6.5)
.217(5.5)
.
.
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics (Ta=25 unless otherwise noted)
Characteristic
Symbo MB05M MB1M MB2M MB4M MB6M MB8M MB10M Unit
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current (Note 1)
@TA=40
Peak Forward Surge Current
8.3ms Single Half Sine-Wave
VRRM
50
100
200
400
600
800
1000
V
VRMS
35
70
140
280
420
560
700
V
VDC
50
100
200
400
600
800
1000
V
0.8
I(AV)
A
30
IFSM
A
SPueapkerFIomrwpoarsdedVoonltRagaeteadt 0L.o8aAd(DJECDEC Method)
VF
1.1
V
Maximum DC Reverse Current
@TJ=25
at Rated DC Bolcking Voltage
@TJ=125
IR
5.0
μA
500
Typical Junction Capacitance Per Element (Note2)
CJ
15
pF
Typical Thermal Resistance (Note3)
RθJC
75
/W
Operating Temperature Range
TJ
-55 to +150
Storage Temperature Range
TSTG
-55 to +150
NOTES: 1.Mounted on P.C. board. 2.Measured at1.0MHz and applied reverse voltage of 4.0V DC.
3.Thermal resistance junction to case.
GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.
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