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UPG110P(1989) Просмотр технического описания (PDF) - NEC => Renesas Technology

Номер в каталоге
Компоненты Описание
производитель
UPG110P
(Rev.:1989)
NEC
NEC => Renesas Technology NEC
UPG110P Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Recommended Wire Length
1. 500 to 1 000 µm for Input (the longer the wire, the better the VSWR)
2. 200 to 500 µm for Output (the shorter the wire, the better the VSWR)
3. It should be bonded via a chip capacitor for VDD.
Wire length is 200 to 500 µm
4. There are five GND pads but GND pad <2> is not used.
Wire length is 200 µm for <1>, <3> and <4>.
Less than 300 µm for <5>.
Chip Size: 1.1 × 1.3 mm
t = 140 µm
Pad Size : 100 × 100 µm
µPG110P
6

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