HSMX-C265(2002) Просмотр технического описания (PDF) - HP => Agilent Technologies

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Компоненты Описание

производитель

HSMX-C265
(Rev.:2002)

Surface Mount Chip LEDs

HP => Agilent Technologies 

10 SEC. MAX.

230°C MAX.

140-160°C

4°C/SEC.

MAX.

OVER 2 MIN.

TIME

4°C/SEC. MAX.

3°C/SEC. MAX.

Figure 6. Recommended reflow soldering profile.

USER FEED DIRECTION

2.2 (0.087) DIA. PCB HOLE

1.4

(0.055)

2.3

(0.091)

1.4

(0.055)

1.25 (0.049)

Figure 7. Recommended soldering pad pattern.

CATHODE SIDE

PRINTED LABEL

Figure 8. Reeling orientation.

3.0 ± 0.5

(0.118 ± 0.020)

Ø 20.20 MIN.

(Ø 0.795 MIN.)

Ø 13.1 ± 0.5

(Ø 0.516 ± 0.020)

8.0 ± 1.0 (0.315 ± 0.039)

10.50 ± 1.0 (0.413 ± 0.039)

178.40 ± 1.00

(7.024 ± 0.039)

4.0 ± 0.5

(0.157 ± 0.020) 6

PS

5.0 ± 0.5

(0.197 ± 0.020)

59.60 ± 1.00

(2.346 ± 0.039)

Figure 9. Reel dimensions.

Note:

1. All dimensions in millimeters (inches).

6

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