µPD3720A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
to consult with our sales offices.
For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E).
Type of Through-hole Device
µPD3720ACY: CCD linear image sensor 22-pin plastic DIP (400 mil)
Process
Wave soldering
(only to leads)
Partial
heating method
Conditions
Solder temperature: 260 ˚C or below,
Flow time: 10 seconds or less.
Pin temperature: 260 ˚C or below,
Heat time: 10 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body dose not get jet soldered.
During assembly care should be taken to prevent solder or flux from contacting the plastic cap.
The optical characteristics could be degraded by such contact.
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