MAC8SD, MAC8SM, MAC8SN
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Junction−to−Ambient
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
Symbol
RqJC
RqJA
TL
Value
2.2
62.5
260
Unit
°C/W
°C
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic
Symbol Min
Typ
Max
OFF CHARACTERISTICS
Peak Repetitive Blocking Current
(VD = Rated VDRM, VRRM; Gate Open)
ON CHARACTERISTICS
IDRM,
TJ = 25°C
IRRM
−
TJ = 110°C
−
−
0.01
−
2.0
Peak On-State Voltage (Note ) (ITM = 11A)
Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 W)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
VTM
−
−
1.85
IGT
−
2.0
5.0
−
3.0
5.0
−
3.0
5.0
Holding Current (VD = 12V, Gate Open, Initiating Current = 150mA)
Latching Current (VD = 24V, IG = 5mA)
MT2(+), G(+)
MT2(−), G(−)
MT2(+), G(−)
IH
−
3.0
10
IL
−
5.0
15
−
10
20
−
5.0
15
Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100W)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
VGT
0.45 0.62
1.5
0.45 0.60
1.5
0.45 0.65
1.5
DYNAMIC CHARACTERISTICS
Rate of Change of Commutating Current
VD = 400 V, ITM = 3.5 A, Commutating dv/dt = 10 V m/sec,
Gate Open, TJ = 110°C, f = 500 Hz, Snubber: CS = 0.01 mF,
RS =15 W, See Figure 16.)
Critical Rate of Rise of Off-State Voltage
(VD = Rate VDRM, Exponential Waveform, RGK = 510 W, TJ = 110°C)
2. Indicates Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
di/dt(c)
8.0
10
−
dv/dt
25
75
−
Unit
mA
V
mA
mA
mA
V
A/ms
V/ms
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