FOD3180 Просмотр технического описания (PDF) - Fairchild Semiconductor
Номер в каталоге
Компоненты Описание
производитель
FOD3180 Datasheet PDF : 13 Pages
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Package Dimensions
Through Hole
4
3
5
6
21
7
8
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
15° MAX
0.300 (7.62)
TYP
Surface Mount
0.390 (9.91)
0.370 (9.40)
4
3
2
1
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.045 (1.14)
0.315 (8.00)
MIN
0.405 (10.30)
MAX.
Note:
All dimensions are in inches (millimeters)
0.4" Lead Spacing
4
3
21
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.004 (0.10) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
8-Pin DIP – Land Pattern
0.070 (1.78)
0.060 (1.52)
0.295 (7.49)
0.415 (10.54)
0.100 (2.54)
0.030 (0.76)
©2005 Fairchild Semiconductor Corporation
FOD3180 Rev. 1.0.6
8
www.fairchildsemi.com
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