74LVC1G08
Electrical Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
-40°C to +85°C
-40°C to +125°C
Symbol Parameter
Test Conditions
VCC
Unit
Min
Typ.
Max
Min
Max
IOH = -100μA
1.65V to 5.5V VCC – 0.1
—
—
VCC – 0.1
—
IOH = -4mA
1.65V
1.2
—
—
0.95
—
IOH = -8mA
VOH
High Level
Output Voltage
IOH = -12mA
IOH = -16mA
IOH = -24mA
2.3V
2.7V
3V
1.9
—
—
1.7
—
2.2
—
—
1.9
—
V
2.4
—
—
2.2
—
2.3
—
—
2.0
—
IOH = -32mA
4.5V
3.8
—
—
3.4
—
IOL = 100μA
1.65V to 5.5V
—
—
0.1
—
0.1
IOL = 4mA
1.65V
—
—
0.45
—
0.7
IOL = 8mA
VOL
Low Level
Output Voltage
IOL = 12mA
IOL = 16mA
IOL = 24mA
2.3V
2.7V
3V
—
—
0.3
—
0.45
—
—
0.4
—
0.6
V
—
—
0.4
—
0.6
—
—
0.55
—
0.8
IOL = 32mA
4.5V
—
—
0.55
—
.8
II
Input Current VI = 5.5V or GND
Power Down
IOFF Leakage
Current
VI or VO = 5.5V
0 to 5.5V
0V
—
± 0.1
±5
—
± 100
μA
—
—
±10
—
±200
μA
ICC Supply Current VI = 5.5V or GND, IO = 0
5.5V
—
0.1
10
—
200
μA
ΔICC
Additional
One input at VCC -0.6V
Supply Current Other inputs at VCC or
3V to 5.5V
—
GND
—
500
—
5,000
μA
Ci
Input
Capacitance
Vi = VCC — or GND
3.3V
—
5
—
—
—
pF
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
θJA
θJC
Parameter
Thermal Resistance
Junction-to-Ambient
Thermal Resistance
Junction-to-Case
Test Conditions
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
VCC
(Note 10)
(Note 10)
Min
Typ
Max
Unit
—
204
—
—
371
—
—
231
—
—
400
—
°C/W
—
435
—
—
445
—
—
470
—
—
460
—
—
52
—
—
143
—
—
105
—
—
225
—
°C/W
—
250
—
—
250
—
—
275
—
—
265
—
Note:
10. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
74LVC1G08
Document number: DS32199 Rev. 10 - 2
4 of 16
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April 2016
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