Pad Configuration
ML1001
Chip Size :
Part Number
ML1001-1U
ML1001-2U
ML1001-3U
Description
a 40 segment static LCD driver
a 80 segment static LCD driver
a 120 segment static LCD driver
Chip Size
3,440 um x 600 um
6,880 um x 600 um
10,320 um x 600 um
Chip Thickness : 400 um + 25 um
Gold Bump Pad Size : 32 um x 72 um
Gold Bump Height : 18 um + 2 um
Right Alignment mark : (1340, -140)
Left Alignment mark : (-1287.2, -138.2)
Origin on the center of ML1001 IC
“Positive” Mark dimension:
Left Mark (Next to the mark “ML1001”)
6um
12um
6um
12um
Right Mark
10um
20um
10um
20um
Note :
1. The die faces up in the diagram.
P6/14
Rev. M, Aug 2012