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HCTS132D Просмотр технического описания (PDF) - Intersil
Номер в каталоге
Компоненты Описание
производитель
HCTS132D
Radiation Hardened Quad 2-Input NAND Schmitt Trigger
Intersil
HCTS132D Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
90 x 90 mils
2.29 x 2.29mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 x 4 mils
Metallization Mask Layout
B1
(2)
HCTS132MS
HCTS132MS
A1
VCC
B4
(1)
(14)
(13)
Y1 (3)
A2 (4)
B2 (5)
NC
NC
(12) A4
(11) Y4
(10) B3
(6)
(7)
Y2
GND
(8)
(9)
Y3
A3
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS132 is TA14483A.
507
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