Characteristics
Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
C(pF)
2000
F = 1 MHz
1000
VOSC = 30 mVRMS
Tj = 25 °C
500
STPS1545
Figure 8: Forward voltage drop versus forward
current (maximum values)
200
100
1
2
VR(V)
5
10
20
50
Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK
(typical values)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0
Epoxy printed board FR4, eCU= 35 µm
SCu(cm²)
5
10
15
20
25
30
35
40
4/13
DocID3504 Rev 7