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Компоненты Описание
HCTS93K Просмотр технического описания (PDF) - Intersil
Номер в каталоге
Компоненты Описание
производитель
HCTS93K
Radiation Hardened 4-Bit Binary Ripple Counter
Intersil
HCTS93K Datasheet PDF : 9 Pages
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HCTS93MS
Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS93MS
MR1
CP1
CP0
(2)
(1)
(14)
MR2 (3)
NC (4)
(13) NC
(12) Q0
(11) Q3
(10) GND
VCC (5)
(9) Q1
(6)
(7)
(8)
NC
NC
Q2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS93 is TA14454A.
Spec Number
518622
488
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