Product Description
ON Semiconductor’s CM6136 is an Application Specific Integrated Passive™ (ASIP™) component in a 2 x 2, 4ïbump, 0.4 mm pitch, CSP form factor. This device is designed for:
• Fuse
• Transient Voltage Suppression (TVS)
• Electrostatic Discharge Protection
• Electrical Overstress Protection
Features
• 4ïBump, 0.8 mm X 0.8 mm Footprint Chip Scale Package (CSP)
• These Devices are PbïFree and are RoHS Compliant
|