Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits
Главная >>> TI >>> TMP006BIYZFR Даташит

TMP006BIYZFR Даташит

Номер в каталогеКомпоненты Описаниепроизводитель
TMP006BIYZFR Infrared Thermopile Sensor in Chip-Scale Package TI
Texas Instruments TI
Other PDF  not available.
TMP006 image

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.
The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.
The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.
The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

• Integrated MEMs Thermopile for Noncontact
   Temperature Sensing
• Local Temperature Sensor for Cold Junction
   – ±1°C (max) from 0°C to 60°C
   – ±1.5°C (max) from –40°C to +125°C
• Two-Wire Serial Interface Options:
   – I2C and SMBus Compatible
   – TMP006 at 3.3 V
   – TMP006B at 1.8 V
   – Eight Programmable Addresses
• Low Power
   – Supply: 2.2 V to 5.5 V
   – Active Current: 240 μA (typ)
   – 1-µA shutdown (max)
• Compact Package
   – 1.6-mm × 1.6-mm × 0.625-mm DSBGA

• Noncontact Temperature Sensing
   – Case Temperature
   – Laser Printers
   – Power Relays
   – Health and Beauty
   – HVAC Comfort Optimization
• Gas Concentration
• Flame Detection

Page Links : 1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30  31  32  33  34  35  36  37  38 

TMP006BIYZFR Другие запросы, связанные с производителем

Номер в каталогеКомпоненты ОписаниеPDFпроизводитель
ADG758BCP 3 Ω, 4-/8-Channel Multiplexers in Chip Scale Package View Analog Devices
ADG781BCP 2.5 Ω Quad SPST Switches in Chip Scale Package View Analog Devices
PACDN1404C ESD Protection Arrays, Chip Scale Package View California Micro Devices => Onsemi
PACDN1404C ESD Protection Arrays, Chip Scale Package View California Micro Devices Corp
HOA0149-001 HOA Series Infrared Reflective Sensor, Transistor Output, Low profile, Plastic Package View Honeywell International
ADG784 CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package View Analog Devices
CM1205 ESD Protection Arrays, Chip Scale Package View California Micro Devices Corp
FCRN303 0805 Precision Thin Film Resistor CSP (Chip Scale Package) View California Micro Devices => Onsemi
PACDN1404CG ESD Protection Arrays in Chip Scale Package View ON Semiconductor

Share Link : 
All Rights Reserved© datasheetq.com 2015 - 2019  ] [ Privacy Policy ] [ Request Datasheet  ] [ Contact Us ]