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MXP1126-C Даташит

Номер в каталогеКомпоненты Описаниепроизводитель
MXP1126-C Photo Transistor Chip Microsemi
Microsemi Corporation Microsemi
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MXP1126-C image

Features
• Light Activated Photo Transistor Chip
• Planar NPN
• Aluminum Wire bondable
• Backside Metallization - Gold
• Die Attach methods: Eutectic or Epoxy

 

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